
Manufacturer Part #
LE9641PQCT
Le9641 Series Subscriber Line Interface Circuit Telephone - QFN-48
Microchip LE9641PQCT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of NSEB (UTL-2) as a new final test site and scan and pack site for selected LE79271, LE9541, LE9621, LE9641, LE9642, LE9643, LE9651, LE9652, LE9653 and ZL88107 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying NSEB (UTL-2) as a new final test site and scan and pack site.
PCN Status:Final NotificationDescription of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9641PQC, LE9651PQC, LE9641PQCT, and LE9651PQCT catalog part numbers (CPN) available in 48L VQFN (7x7x1.0mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9641PQC, LE9651PQC, LE9641PQCT, and LE9651PQCT catalog part numbers (CPN) available in 48L VQFN (7x7x1.0mm) package assembled at MMT assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9641PQC, LE9651PQC, LE9641PQCT, and LE9651PQCT catalog part numbers (CPN) available in 48L VQFN (7x7x1.0mm) package assembled at ASEM assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9641PQC, LE9651PQC, LE9641PQCT, and LE9651PQCT catalog part numbers (CPN) available in 48L VQFN (7x7x1.0mm) package assembled at ASEM assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9641PQC, LE9651PQC, LE9641PQCT, and LE9651PQCT catalog part numbers (CPN) available in 48L VQFN (7x7x1.0mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9641PQC, LE9651PQC, LE9641PQCT, and LE9651PQCT catalog part numbers (CPN) available in 48L VQFN (7x7x1.0mm) package assembled at MMT assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Revision History:February 12, 2021: Issued initial notification.April 5, 2021: Issued final notification. Attached theQualification Report. Removed Pre and Post Change fields. Provided estimated first ship date to be on March 30, 2021.Description of Change:Qualification of MTAI as an additional assembly site for selected MSCC products available in 48L VQFN (7x7x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Description of Change:Qualification of MTAI as an additional assembly site for selected MSCC products available in 48LVQFN (7x7x1mm) package.Pre Change:Assembled at ASEM assembly site without lead-lock, using PdCu bond wire, CRM1076DS die attach and CEL-9240HF10AK-G1 mold compound.ORAssembled at UNIC assembly site without lead-lock, using CuPdAu bond wire, 8290 die attach and G770HP mold compound.ORAssembled at MMT assembly site with lead-lock, using CuPdAu bond wire, 3280 die attach and G700LTD mold compound.Post Change:Assembled at ASEM assembly site without lead-lock, using PdCu bond wire, CRM1076DS die attach and CEL-9240HF10AK-G1 mold compound.ORAssembled at UNIC assembly site without lead-lock, using CuPdAu bond wire, 8290 die attach and G770HP mold compound.ORAssembled at MMT assembly site with lead-lock, using CuPdAu bond wire, 3280 die attach and G700LTD mold compound.ORAssembled at MTAI assembly site with lead-lock, using CuPdAu bond wire, 3280 die attach and G700LTD mold compound.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date:February 2021
Part Status:
Available Packaging
Package Qty:
3000 per Std. Mfr. Pkg