Manufacturer Part #
ATECC608B-SSHCZ-T
Authentication Chip 8-SOIC
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:4000 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip ATECC608B-SSHCZ-T - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:June 24, 2022: Issued initial notification.October 27, 2022: Issued final notification. Updated affected CPN list to include catalog part numbers (CPN) released prior issuance of the Final PCN. Attached the qualification report and added estimated first ship date by November 04, 2022Description of Change:Qualification of MTAI as an additional final test site for selected ATECC108A-SSxxx-x, ATECC508A-SSxxx-x, ATECC608A-SSxxx-x, ATECC608B-SSxxx-x and ATSHA204A-SSxxx-x device families available in 8L SOIC (3.90mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.
Cancellation Notification: (Previously Issued under Future PCN 90029)Revision History:May 11, 2022: Issued initial notification. November 09, 2022: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package. Reason for Change:Microchip has decided to not qualify MTAI as an additional assembly site for selected
Revision History:September 13, 2022: Issued initial notification.October 18, 2022: Issued final notification. Attached the Qualification Report. Revised the Impact to datasheet from Yes to None. Revised the ASSH plant name from ASE Advanced Semiconductor (Shanghai) Co., Ltd. to ATX Semiconductor (Shanghai)Co., Ltd. Provided estimated first ship date to be on October 31, 2022.Description of Change:Qualification of MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package using QMI519 die attach material.Pre and Post Change Summary: : see attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly.Change Implementation Status:In ProgressEstimated First Ship Date:October 31, 2022 (date code: 2245)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary:: see attached
Description of Change:Qualification of MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package using QMI519 die attach material.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly.
Description of Change:Qualification of MTAI as an additional final test site for selected ATECC108A-SSxxx-x, ATECC508A-SSxxx-x, ATECC608A-SSxxx-x, ATECC608B-SSxxx-x and ATSHA204A-SSxxx-x device families available in 8L SOIC (3.90mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:August 2022
Microchip has released a new Product Documents for the ATECC608B CryptoAuthentication Device Summary Data Sheet of devices.Notification Status: FinalDescription of Change:1) Added ISLEEP current specification for Extended Industrial Temperature Range. Table 2-52) Added 3. ATECC608B Trust Platform Variants and Provisioning Services and notes 4 and 5 on Trust Platform Devices in the Product Identification System (PIS).3) Updated SMBUS tTIMEOUT specification. Table 2-44) Renamed tTIMEOUT for SWI Interface to tTIMEOUT-SWI because of duplication of parameter name. Table 2-3Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 29 October 2021
Part Status:
Available Packaging
Package Qty:
4000 per Reel