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Manufacturer Part #
PIC18LF47K40T-I/MV
128KB Flash, 4KB RAM, 1KB EE, 10b ADC2, DAC, COMP, PWM, CWG, HLT, WWDT,
Microchip PIC18LF47K40T-I/MV - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:November 25, 2021: Issued initial notification.November 17, 2023: Issued cancellation notification.PCN Status:Cancellation Notification Description of Change:This qualification was originally performed to qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Change Implementation Status:Not applicableEstimated Qualification Completion Date:Not applicable
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected HA7621T, PIC16Fxxx, PIC16LF1xxx, PIC18F4xxx and PIC18LF4xxx device families available in 40L UQFN (5x5x0.5mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023
Microchip has released a new Errata for the PIC18(L)F27/47K40 Family Silicon Errata and Data Sheet Clarifications of devices.Description of Change: Removed 2.1.2. Added silicon errata 2.1.6, 2.1.7, 2.1.8, 2.4.2, 2.5.3, 2.10.1, 2.11.1, 2.12.1. Removed Data Sheet clarification for Operating speed. Modified 3.2.1 (Electrical Specification) ADC Offset Error updated to -+3.0LSb.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Sep 2022
Part Status:
Available Packaging
Package Qty:
3300 per Reel