
Manufacturer Part #
23LC1024T-E/ST
23LC1024: 1Mb (128K x 8) 5.5 V SPI Serial SRAM w/ SDI and SQI Interface -TSSOP-8
Microchip 23LC1024T-E/ST - Product Specification
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Description of Change:Qualification of MMT as an additional assembly site for selected 23LC1024, 23A1024, 23LC512, 23A512, 23LCV1024, and 23LCV512 device families available in 8L TSSOP (4.4mm) package.Reason for Change:Improve on-time delivery performance by qualifying MMT as an additional assembly site.
Microchip has released a new Datasheet for the 23A1024/23LC1024 1-Mbit SPI Serial SRAM with SDI and SQI Interface Data Sheet ofdevices. Description of Change:1. Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client? respectively.2. Updated PDIP, SOIC and TSSOP package drawings.3. Added Automotive Product Identification System.Reason for Change: To Improve Productivity
Part Status:
Microchip 23LC1024T-E/ST - Technical Attributes
Memory Density: | 1Mb |
Memory Organization: | 128K x 8 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Access Time-Max: | 32ns |
Temperature Grade: | Extended |
Number of Words: | 128 K |
Word Length: | 8b |
Operating Temp Range: | -40°C to +125°C |
Moisture Sensitivity Level: | 1 |
Package Style: | TSSOP-8 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2500 per Reel
Package Style:
TSSOP-8
Mounting Method:
Surface Mount