
Référence fabricant
AT86RF215-ZU
Dual Band IEEE 802.15.4 Transceiver
Microchip AT86RF215-ZU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAM3S2A, ATSAM3S4A, ATSAM3S1A, ATSAM3N00A,ATSAM3N1A, ATSAM3N0A, AT91SAM7S32, AT86RF215M, ATmega1284RFR2, ATmega2564RFR2, ATmega644RFR2, AT86RF215, AT86RF215IQ, ATSAM4LS8A, ATSAM4LC8A, AT91SAM7S321, and ATSAM3N0AA device families available in 48L VQFN (7x7x1.0mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as an additional assembly site for selected AT86RF215, ATmega644/1284/2564RFR2 and ATSAM4Lx8xx device families available in 48L VQFN (7x7x0.9mm) package.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:December 29, 2021 (date code: 2153)Method to Identify Change:Traceability code
Description of Change:Qualification of MTAI as an additional assembly site for selected AT86RF215, ATmega644/1284/2564RFR2 and ATSAM4Lx8xx device families available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date:July 2021
Statut du produit:
Microchip AT86RF215-ZU - Caractéristiques techniques
Data Rate: | 2.4Mbps |
Output Power: | 16dBm |
Supply Voltage: | 1.8V to 3.6V |
Sensitivity: | -123dBm |
Style d'emballage : | QFN-48 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
416 par Tray
Style d'emballage :
QFN-48
Méthode de montage :
Surface Mount