Référence fabricant
MCP79400T-I/SN
MCP79400 Series 5.5 V 64 byte SMT I2C™ Real-Time Clock/Calendar - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2406 | ||||||||||
Microchip MCP79400T-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Data Sheet - MCP79400/01/02 Battery-Backed I2C RTCC w/ SRAM and Protected EEPROM Data Sheet Document RevisionDescription of Change: 1) Updated Section 6.3. 2) Updated Product Identification System.Reason for Change: To Improve ProductivityNOTE: Please be advised that this is a change to the document only the product has not been changed.
Statut du produit:
Microchip MCP79400T-I/SN - Caractéristiques techniques
| Date Format: | DW:DM:M:Y |
| Time Format: | HH:MM:SS |
| Interface: | I2C |
| Non-Volatile Memory Size: | 64B |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The clock/calender automatically adjusts for months with fewer than 31 days, including corrections for leap years and low-cost 32.768 kHz crystal is used to track the time.
Features:
- Real-Time Clock/Calendar (RTCC), Battery Backed:
- Hours, Minutes, Seconds, Day of Week, Day, Month and Year
- Dual alarm with single output
- On-Chip Digital Trimming/Calibration:
- Range -127 to +127 ppm
- Resolution 1 ppm
- Programmable Open-Drain Output Control:
- CLKOUT with 4 selectable frequencies
- Alarm output
- 64-Bit Unique ID:
- User or factory programmable
- Protected EEPROM
- EUI-48™ or EUI-64™ MAC address
- Custom ID programming
- Automatic VCC Switchover to VBAT Backup Supply
- Power-Fail Time-Stamp for Battery Switchover
- Low-Power CMOS Technology:
- Dynamic Current: 400 µA max read
- Dynamic Current: 400 µA max SRAM
- Battery Backup Current: <700nA @ 1.8V
- 100 kHz and 400 kHz Compatibility
- ESD Protection >4,000V
- 1 Million Erase/Write Cycles for Unique ID
- Packages include 8-Lead SOIC, TSSOP, 2x3 TDFN, MSOP
- Pb-Free and RoHS Compliant
- Temperature Ranges:
- Industrial (I): -40°C to +85°C
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount