Référence fabricant
MCP2122T-E/SN
MCP2122 Series 115.2 kBaud Low Power Mode Infrared Encoder / Decoder - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP2122T-E/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip MCP2122T-E/SN - Caractéristiques techniques
| No of Channels: | 2 |
| Operating Voltage: | 5.5V |
| Rise Time / Fall Time: | 7.5ns |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP2122 is a stand-alone IrDA standard encoder/ decoder device that is pinout-compatible with the Agilent® HSDL-7000 encoder/decoder. The MCP2122 has two interfaces: the host UART interface and the IR interface. The host UART interfaces to the UART of the Host Controller.
The Host Controller is the device in the embedded system that transmits and receives the data. The IR interface connects to an infrared (IR) optical transceiver circuit that converts electrical pulses into IR light (encode) and converts IR light into electrical pulses (decode). This IR optical transceiver circuit could be either a standard infrared optical transceiver (such as a Vishay® TFDU 4300) or it could be implemented with discrete components. For additional information, please refer to AN243, “Fundamentals of the Infrared Physical Layer” (DS00243).
Features:
- Pinout compatible with HSDL-7000
- Compliant with IrDA® Standard Physical Layer Specification (version 1.3)
- UART to IrDA Standard Encoder/Decoder
- Interfaces with IrDA Standard Compliant Transceiver
- Baud Rates:
- Up to IrDA Standard 115.2 Kbaud Operation
- Transmit/Receive Formats (Bit Width) Supported:
- 1.63 μs
- Low-power Mode (2 μA at 1.8 V, +125°C)
- Pb-free packaging
Applications:
- Data-Logging/Data Exchange
- System Setup
- System Diagnostic Read Out
- Manufacturing Configuration
- Host Controller Firmware Updates
- System Control
View the complete product family of MCP212x Optical Encoder
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount