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Référence fabricant
AVR16EB14-E/SL
AVR EB Series 16 kB Flash 2 kB RAM 20 MHz 8-Bit Microcontroller - SOIC-14
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :57 par Tube Style d'emballage :SOIC-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2427 | ||||||||||
Microchip AVR16EB14-E/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Statut du produit:
Microchip AVR16EB14-E/SL - Caractéristiques techniques
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| RAM Size: | 2kB |
| Speed: | 20MHz |
| No of I/O Lines: | 11 |
| InterfaceType / Connectivity: | IrDA/I2C/SMBUS/SPI/UART/USART |
| Peripherals: | Brownout Reset/Brown-out Detect/POR/PWM |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 8-chx12-bit |
| Style d'emballage : | SOIC-14 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
57 par Tube
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount
