Référence fabricant
ATMEGA324PB-AUR
IC, 8-BIT Microcontroller, 32KB FLASH In a 44 pin TQFP package
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2000 par Reel Style d'emballage :TQFP-44 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2420 | ||||||||||
Microchip ATMEGA324PB-AUR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:August 26, 2021: Issued initial notification.March 29, 2022: Issued final notification. Provided estimated first ship date to be on April 29, 2022.September 30, 2022: Re-issued final notification. Updated wire material for ASCL assembly site to add CuPdAu bond wire. Updated affected part list to remove catalog part numbers ATMEGA324PB-AN, ATMEGA324PB-ABT and add CPN PIC16F18075-I/P based on the updated scope. Updated subject notification, reason for change and qual title accordingly.October 28, 2022: Re-issued final notification with qual report. Updated Estimated Implementation and Estimated First Ship date to November 10, 2022.Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA324PBxxx and PIC16F1xxx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Revision History:August 26, 2021: Issued initial notification.March 29, 2022: Issued final notification. Provided estimated first ship date to be on April 29, 2022.September 30, 2022: Re-issued final notification. Updated wire material for ASCL assembly site to add CuPdAu bond wire. Updated affected part list to remove catalog part numbers ATMEGA324PB-AN, ATMEGA324PB-ABT and add CPN PIC16F18075-I/PT based on the updated scope. Updated subject notification, reason for change and qual title accordingly.Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA324PBxxx and PIC16F1xxx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Revision History:August 26, 2021: Issued initial notification.March 29, 2022: Issued final notification. Provided estimated first ship date to be on April 29, 2022Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA324PBxxx and PIC16F1527xxx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Statut du produit:
Microchip ATMEGA324PB-AUR - Caractéristiques techniques
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 32kB |
| RAM Size: | 2kB |
| Speed: | 20MHz |
| No of I/O Lines: | 39 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 8-chx10-bit |
| Style d'emballage : | TQFP-44 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2000 par Reel
Style d'emballage :
TQFP-44
Méthode de montage :
Surface Mount