Référence fabricant
R7F7010133AFP#BA4
32BIT MCU RH850/F1L FLS 64LQFP
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| Nom du fabricant: | Renesas | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :160 par Tray | ||||||||||
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Renesas R7F7010133AFP#BA4 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Renesas Product Type: RH850/F1x and R1x Series Description of Change: Renesas has implemented the standardization of assembly materials such as bonding-wire change to Cu-wire and the revision of Core-Voltage-Monitor circuits for Naka Wafer Production (RSC, Nishiki / Assembly) products to realize stable supply. The change of bonding wire to Cu-wire was already introduced via PCN no. EE-QR-200514-xx for TSMC Wafer Production. Reason for Change: For stable supply of products and immunity improvement to power-supply noise. Schedules: Sample Order Until March 2022 lSample submission: From b/o Feb.2022 onwards (upon request) Qualification results: Available (please refer to page 4-9) Requested approval Until May 2022 Implementation of change From Apr. 2022 onwards possib
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
160 par Tray