Référence fabricant
R5F3650TDFB#30
M16C Series 16 Bit 47 KB RAM 768 KB Flash 85 I/O Microcontroller - LQFP-100
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| Nom du fabricant: | Renesas | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :90 par Tray Style d'emballage :LQFP-100 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Renesas R5F3650TDFB#30 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.Reason for Change: To secure a stable product supply and environment friendly strengthening (Improvement of efficiency in use of packaging resources, reduction of waste)
The purpose of this notification is to communicate a product change of select Renesas Electronics America, Inc. (REA) devices. This notification announces the addition of full carton part numbers for select MCU & SOC devices. Full carton shipments will be standard and combine a maximum of 3 production lots. See the appendix for additional details. The full carton shipments will have a new part number. There is no impact to the specifications, fit, form, characteristics, quality & reliability of the products.
The purpose of this notification is to communicate a product change of select Renesas Electronics America, Inc. (REA) devices. This notification announces the addition of full carton part numbers for select MCU & SOC devices. Full carton shipments will be standard and combine a maximum of 3 production lots. See the appendix for additional details. The full carton shipments will have a new part number. There is no impact to the specifications, fit, form, characteristics, quality & reliability of the products.
Subject: MCU/SOC products announcement of Full Carton.Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.
This notification announces one or more of the following assembly changes for select M16C and M32C devices. 1. Bonding Wire Change from Au to Cu 2. Lead Frame Change 3. Additional Mold Compound 4. Solder Paste Change from SnCu to Sn 5. Top Mark Change 6. Assembly Site Reduction from RSB & ATJ to RSB only The "Change Notes" in the part list outlines the specific change(s). Some devices have new part numbers, other devices will have no change to the part number. There is no impact to form, fit, quality & reliability of the products.
Statut du produit:
Renesas R5F3650TDFB#30 - Caractéristiques techniques
| Family Name: | M16C |
| Core Processor: | M16C/60 |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 768kB |
| RAM Size: | 47kB |
| Speed: | 32MHz |
| No of I/O Lines: | 85 |
| InterfaceType / Connectivity: | EBI/EMI/I2C/SIO/UART/USART |
| Peripherals: | DMA/LVD/POR/PWM/Watchdog |
| Number Of Timers: | 11 |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 26-chx10-bit |
| On-Chip DAC: | 2-chx8-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | LQFP-100 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
90 par Tray
Style d'emballage :
LQFP-100
Méthode de montage :
Surface Mount