Référence fabricant
71V3556SA166BGI
128K x 36 3.3V Synchronous ZBT SRAMs 3.3V I/O, Burst Counter Pipeline
Renesas 71V3556SA166BGI - Spécifications du produit
Informations de livraison:
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Description of Change:Renesas is changing the substrate supplier to ASEE, Taiwan as a result of the current supplier UMTC, Taiwan discontinued the manufacturing of substrate for product PBGA-119 and PBGA-416. ASEE has decades of experience and expertise in Flip Chip BGA/CSP substrates and is ranked among the top 10 worldwide substrate suppliers interms of revenue. Refer to appendix for the company profile. There will be no changes to the substrate design, physical dimensions and electrical performance. ASEE will be exactly the same as UMTC substrate in terms of form, fit and function.Refer to appendix for comparison between the current substrate suppliers versus the newly qualified substrate supplier on the attached.Reason for Change:The current substrate supplier discontinued the manufacturing line on the select packages.Impact on Fit, Form, Function, Quality & Reliability:The change will have no impact on the product form, fit, function, quality, reliability and environmental compliance of the products.
Statut du produit:
Renesas 71V3556SA166BGI - Caractéristiques techniques
Memory Density: | 4.5Mb |
Memory Organization: | 128 K x 36 |
Supply Voltage-Nom: | 3.135V to 3.465V |
Access Time-Max: | 3.5ns |
Temperature Grade: | Industrial |
Speed: | 166MHz |
Number of Words: | 128 K |
Word Length: | 36b |
Power Dissipation: | 2W |
Supply Current: | 360mA |
Interface Type: | Parallel |
Operating Temp Range: | -40°C to +85°C |
Storage Temperature Range: | -55°C to +125°C |
Moisture Sensitivity Level: | 3 |
Style d'emballage : | BGA-119 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
84 par Tray
Style d'emballage :
BGA-119
Méthode de montage :
Surface Mount