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Référence fabricant
23LC1024T-E/ST
23LC1024: 1Mb (128K x 8) 5.5 V SPI Serial SRAM w/ SDI and SQI Interface -TSSOP-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2500 par Reel Style d'emballage :TSSOP-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip 23LC1024T-E/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of MMT as an additional assembly site for selected 23LC1024, 23A1024, 23LC512, 23A512, 23LCV1024, and 23LCV512 device families available in 8L TSSOP (4.4mm) package.Reason for Change:Improve on-time delivery performance by qualifying MMT as an additional assembly site.
Microchip has released a new Datasheet for the 23A1024/23LC1024 1-Mbit SPI Serial SRAM with SDI and SQI Interface Data Sheet ofdevices. Description of Change:1. Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client? respectively.2. Updated PDIP, SOIC and TSSOP package drawings.3. Added Automotive Product Identification System.Reason for Change: To Improve Productivity
Statut du produit:
Microchip 23LC1024T-E/ST - Caractéristiques techniques
| Memory Density: | 1Mb |
| Memory Organization: | 128K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Access Time-Max: | 32ns |
| Temperature Grade: | Extended |
| Number of Words: | 128 K |
| Word Length: | 8b |
| Operating Temp Range: | -40°C to +125°C |
| Moisture Sensitivity Level: | 1 |
| Style d'emballage : | TSSOP-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2500 par Reel
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount