Référence fabricant
23K256-I/SN
23K256 Series 2.7 V to 3.6 V 256 kbit SPI Bus Low-Power Serial SRAM - SOIC-8
Microchip 23K256-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: - Replaced Automotive with Extended; Replaced terminology �Master� with �Host�; Updated PDIP, SOIC and TSSOP package drawings. Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 2 May 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Statut du produit:
Microchip 23K256-I/SN - Caractéristiques techniques
Memory Density: | 256kbps |
Memory Organization: | 32 K x 8 |
Supply Voltage-Nom: | 2.7V to 3.6V |
Operating Temperature: | -40°C to +85°C |
Storage Temperature Range: | -65°C to +150°C |
Style d'emballage : | SOIC-8 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The 23X256 are 256 Kbit Serial SRAM devices. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input.
Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 23X256 is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead TSSOP.
Features:
- Max. Clock 20 MHz
- Low-Power CMOS Technology: - Read Current: 3 mA at 1 MHz - Standby Current: 4 μA Max. at 3.6 V
- 32,768 x 8-bit Organization
- 32-Byte Page
- HOLD pin
- Flexible Operating modes: - Byte read and write - Page mode (32 Byte Page) - Sequential mode
- Sequential Read/Write
Learn more about the 23K256 family of Memory Device
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount