Référence fabricant
AT24C256C-SSHL-T
AT24C256C Series 256 Kb (32 K x 8) 1.7 V I2C-Compatible Serial EEPROM - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :4000 par Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2233 | ||||||||||
Microchip AT24C256C-SSHL-T - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the AT24C256C I�C-Compatible (Two-Wire) Serial EEPROM 256-Kbit (32,768 x 8) Data Sheet of devices. Notification Status: FinalDescription of Change: Updated VFBGA and SOIC package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Sep 2022
Description of Change:Qualification of 66.88K wafer technology for AT24C256C-XHL-B, AT24C256C-XHL-T, AT24C256C-SSHL-B, AT24C256C-SSHL-T, AT24C256C-MAHL-T and AT24C256C-MAHL-E catalog part numbers (CPN) available in 8L TSSOP (4.4mm), 8L SOIC (3.90mm) and 8L UDFN (2x3x0.6mm) packages at UMC Fab 8D fabrication site.Reason for Change:To improve manufacturability by qualifying 66.88K wafer technology at UMC Fab 8D fabrication site.
Microchip has released a new Datasheet for the AT24C256C I�C-Compatible (Two-Wire) Serial EEPROM 256-Kbit (32,768 x 8) of devices.Description of Change:1) Updated section content throughout for clarification. Added note to Table 4-6 that explains the array architecture and howendurance is specified. Updated Part Marking information. Updated the SOIC, TSSOP and UDFN package drawings.Reason for Change: To Improve Productivity
Statut du produit:
Microchip AT24C256C-SSHL-T - Caractéristiques techniques
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
4000 par
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount