Référence fabricant
24LC32AT-E/ST
24LC32A Series 32 kb 5.5 V Surface Mount I2C 2 Wire Serial EEPROM - TSSOP-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2500 par Reel | ||||||||||
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Microchip 24LC32AT-E/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Microchip has released a new Product Documents for the 24AA32A/24LC32A 32-Kbit I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change:1.Updated formatting to current template.2.Replaced terminology �Master� and �Slave� with �Host� and �Client� respectively.3.Removed CSP product offering.4. Added Automotive Product Identification System.5. Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 Nov 2021
Microchip has released a new Product Documents for the 24AA32A/24LC32A 32-Kbit I2C Serial EEPROM Data Sheet of devices.Description of Change:1.Updated formatting to current template.2.Replaced terminology �Master� and �Slave� with �Host� and �Client� respectively.3.Removed CSP product offering.4. Added Automotive Product Identification System.5. Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings. Reason for Change: To Improve Productivity Date Document Changes Effective: 23 Nov 2021
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
2500 par Reel