Référence fabricant
24LC64-I/SN
24LC64 Series 64 Kb I2C 2 Wire (8K X 8) 2.5 V Serial EEPROM SMT - SOIC-8
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2333 | ||||||||||
Microchip 24LC64-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:April 9, 2022: Re-issued this PCN to update the affected CPN list by removing 24FC64F, 24LC64F, 24AA64F products.Notification Status: FinalDescription of Change:1) Added Product Identification System section for Automotive;2) Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings;3) Added DFN-S product offering;4) Replaced terminology Master and Slave with Host and Client, respectively;5) Replaced Automotive (E): designation with Extended (E): designation;6) Reformatted some sections for better readability.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 18 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Microchip has released a new Product Documents for the 24AA64/24FC64/24LC64 64-Kbit I2C Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 24AA64/24FC64/24LC64 64-Kbit I2C Serial EEPROM Data Sheet.Notification Status: FinalDescription of Change:1) Added Product Identification System section for Automotive;2) Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings;3) Added DFN-S product offering;4) Replaced terminology �Master� and �Slave� with �Host� and �Client�, respectively;5) Replaced �Automotive (E):� designation with �Extended (E):� designation;6) Reformatted some sections for better readability.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 18 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip 24LC64-I/SN - Caractéristiques techniques
| Memory Density: | 64kb |
| Memory Organization: | 8 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The 24LC64 is a 64 Kbit electrically Erasable PROM is organized as a single block of 8 K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 2.5 V, with standby and active currents of only 1 μA and 1 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition.
The 24LC64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space. The 24LC64 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, DFN, TDFN and MSOP packages. The 24LC64 is also available in the 5-lead SOT-23 package.
Features:
- Single-Supply with Operation down to 2.5 V
- Low-Power CMOS Technology
- 2-Wire Serial Interface, I2C™ Compatible
- Cascadable up to 8 Devices
- Schmitt Trigger Inputs for Noise Suppression
- Output Slope Control to Eliminate Ground Bounce
- 100 kHz and 400 kHz Clock Compatibility
- Page Write Time 5 ms, typical
- Self-timed Erase/Write Cycle
- 32-Byte Page Write Buffer
- Hardware Write-protect
- ESD Protection > 4,000 V
- More than 1 Million Erase/Write Cycles
- Data Retention > 200 Years
- Factory Programming Available
Learn more about the 24LC64 family of EEPROM
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount
