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Référence fabricant
S1D13705F00A200
LCD Controller, Built-in 80KB SRAM, Swivel View, QVGA
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| Nom du fabricant: | Epson Electronics America | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :119 par Tray Style d'emballage :QFP-14-80 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Epson Electronics America S1D13705F00A200 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
We would like to hereby inform that we will change IC manufacturing equipment of the applicable product as mentioned below. The background of the change is that we have been informed from ASECL, our packaging subcontractor, that they have limited the production number of the IC using the current manufacturing equipment. Besides, the subcontractor plans to discontinue the assembly line using the current manufacturing equipment in the first half of 2024, due to aging equipment, unavailability of after service parts of the equipment and so on.We have already contacted ASECL for the status of the production and requested to continue the production of the assembly line using the current manufacturing equipment. But we suppose that it will be difficult to receive a supply of the current products from ASECL and supply such products to our customers continuously in consideration of the situation at ASECL
Terminal plating (Sn-Bi to Pure-Sn) As you know, demand for environmentally friendly semiconductor products is rising day by day. The number of customers who demand "Bismuth-free terminal plating" is also increasing. We have individually reacted to this demand. By these individual correspondences, the number of individual specifications of Pure-Sn plating has increased and made working efficiency worse. We like to unify the specifications of terminal plating, promoting "Pure Sn" plating.
Terminal Plating ChangeAs you know, demand for environmentally friendly semiconductor products has risen day by day. Number of customers who demand “Bismuth -free terminal plating” is also increasing.We have individually corresponded about the demand. By the individual correspondences, number of specification of the Pure-Sn plating has increased andthe specifications made working efficiency worse. We like to unify specifications of terminal plating, promoting 'Pure Sn' plating.
Terminal plating change (Sn-Bi to Pure-Sn)Epson eliminating the SnBi lead frame plating and moving to a PURE Sn plating for our IC products.As you know, demand for environmentally friendly semiconductor products has risen day by day. Number of customers who demand "Bismuth-free terminal plating" is also increasing. We have individually corresponded about the demand. By the individual correspondences, number of specification of the Pure-Sn plating has increased and the specifications made working efficiency worse. We like to unify specifications of terminal plating, promoting "Pure-Sn" plating.
Statut du produit:
Epson Electronics America S1D13705F00A200 - Caractéristiques techniques
| Style d'emballage : | QFP-14-80 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
119 par Tray
Style d'emballage :
QFP-14-80
Méthode de montage :
Surface Mount
