Référence fabricant
S1D13742F01A200
LCD Controller, Built-in 768KB SRAM, Swivel View, VGA
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| Nom du fabricant: | Epson Electronics America | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :60 par Tray Style d'emballage :QFP-144 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Epson Electronics America S1D13742F01A200 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
First of all, we sincerely apologize for inconvenience of not delivering our IC products as you requested because of rising prices or longer lead-time for procuring materials to be used with IC package due to very strong demand of semiconductor devices in worldwide. We have been approaching a variety of measures to reduce the risk of not delivering IC products.We would like to hereby inform that we will add IC packaging factory of the applicable products as mentioned. The background of the addition is that we utilize ASECL (please refer attached) for our packaging process currently, and we are facing serious delivery problems due to their capacity limitation. To improve current situations quickly, we judged to utilize our own factory, SEP (please refer below) simultaneously. SEP produces some types of QFP and BGA products. For your information, we transferred our packaging process of your products from SEP to ASECL in 2018. After the addition of SEP as IC packaging factory, applicable products will be produced in ASECL or SEP flexibly depending on the capacity of ASECL and SEP. For smooth addition of our factory, we'd like to confine the applicable products to the products which can be produced by using the same materials and same conditions as SEP used to use before the transfer to ASECL in 2018.
Terminal plating (Sn-Bi to Pure-Sn) As you know, demand for environmentally friendly semiconductor products is rising day by day. The number of customers who demand "Bismuth-free terminal plating" is also increasing. We have individually reacted to this demand. By these individual correspondences, the number of individual specifications of Pure-Sn plating has increased and made working efficiency worse. We like to unify the specifications of terminal plating, promoting "Pure Sn" plating.
Terminal Plating ChangeAs you know, demand for environmentally friendly semiconductor products has risen day by day. Number of customers who demand “Bismuth -free terminal plating” is also increasing.We have individually corresponded about the demand. By the individual correspondences, number of specification of the Pure-Sn plating has increased andthe specifications made working efficiency worse. We like to unify specifications of terminal plating, promoting 'Pure Sn' plating.
Terminal plating change (Sn-Bi to Pure-Sn)Epson eliminating the SnBi lead frame plating and moving to a PURE Sn plating for our IC products.As you know, demand for environmentally friendly semiconductor products has risen day by day. Number of customers who demand "Bismuth-free terminal plating" is also increasing. We have individually corresponded about the demand. By the individual correspondences, number of specification of the Pure-Sn plating has increased and the specifications made working efficiency worse. We like to unify specifications of terminal plating, promoting "Pure-Sn" plating.
Statut du produit:
Epson Electronics America S1D13742F01A200 - Caractéristiques techniques
| Target LCD Panels: | TFT |
| Display Memory: | 768 KB |
| Input Voltage: | 1.4V to 1.6V |
| Style d'emballage : | QFP-144 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
60 par Tray
Style d'emballage :
QFP-144
Méthode de montage :
Surface Mount