Référence fabricant
MSC017SMA120J
Discrete Semiconductor Modules MOSFET SIC 1200 V 17 mOhm SOT-227
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :10 par | ||||||||||
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Microchip MSC017SMA120J - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification Microchip Technology Colorado � Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:To improve productivity and on-time delivery performance by qualifying MCSO as an additional fabrication site.
Description of Change:Implementation of Die Overcoat material with Polyimide layer selected Microsemi SIC MOSFET product of MSCxxxSMA070, MSCxxxSMA120, and MSCxxxSMA170 device families in DICE, SOT-227, TO-247, TO-263 and TO-268 packages.Reason for Change:To improve productivity by implementing Die Overcoat (polyimide layer)
PCN Status:Final NotificationDescription of Change:Implement top marking changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products available in TO-247, TO-263, TO-268, TO-220 and SOT-227 packages.Reason for Change:To improve productivity by standardizing the top marking as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2023 (date code: 2313)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Implement Microchip Inner Labels and documentation changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:February 17, 2023 (date code: 2307)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
10 par