Référence fabricant
MSC030SDA070B
700 V 60 A Through Hole Zero Recovery Silicon Carbide Schottky Diode - TO-247
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Bulk Style d'emballage :TO-247-2 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Microchip MSC030SDA070B - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:September 22, 2022: Issued initial notification.May 9, 2023: Issued final notice. Attached the qualification report and included the estimated first ship date on May 30, 2023.Description of Change:Qualification of Microchip Technology Colorado � Fab 5 (MCSO) as an additional fabrication site for 700V and 1200V SiC Schottky Barrier Diode (SBD) products of MSC010SDA070xx, MSC010SDA120xx, MSC015SDA120xx, MSC020SDA120xx, MSC030SDA070xx, MSC030SDA120xx,MSC030SDB070B, MSC050SDA070xx, MSC050SDA120xx, MSC2X1xxSDA070J, MSC2X1xxSDA120J, MSC2X21DC120J, MSC2X3xSDA070J, MSC2X3xSDA120J, MSC2X5xSDA070J, MSC2X5xSDA120J, MSC2X61DC120J device families available in die sales products, 2L TO-268, 2L TO-220, 2L TO-247, and 4L SOT-227 packages.Reason for Change:To improve on-time delivery performances by qualifying MSCO as an additional fab site.
PCN Status:Final NotificationDescription of Change:Implement top marking changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products available in TO-247, TO-263, TO-268, TO-220 and SOT-227 packages.Reason for Change:To improve productivity by standardizing the top marking as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2023 (date code: 2313)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Implement Microchip Inner Labels and documentation changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:February 17, 2023 (date code: 2307)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status:Initial NotificationDescription of Change:Qualification of Microchip Technology Colorado � Fab 5 (MCSO) as an additional fabrication site for 700V and 1200V Silicon Carbide (SiC) Schottky Barrier Diodes (SBDs) products of MSC0xxSDA070xx, MSC0xxSDA120xx, MSC2X10xSDA070x, MSC2X10xSDA120x, MSC2X21DC120J, MSC2XxxSDA070x, MSC2XxxSDA120x, and MSC2X61DC120J device families available in die sales products, 2L TO-268, 2L TO-220, 2L TO-247, and 4L SOT-227 packages.Reason for Change:To improve on-time delivery performances by qualifying MSCO as an additional fab site.
Statut du produit:
Microchip MSC030SDA070B - Caractéristiques techniques
| Technology: | SiC (Silicon Carbide) Schottky |
| Reverse Voltage-Max: | 700V |
| Capacitance: | 1200pF |
| Average Rectified Current-Max: | 60A |
| Forward Voltage: | 1.8V |
| Leakage Current: | 200µA |
| Operating Temp Range: | -55°C to +175°C |
| Product Status: | Active |
| Style d'emballage : | TO-247-2 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
1 par Bulk
Style d'emballage :
TO-247-2
Méthode de montage :
Through Hole