Référence fabricant
KSZ8081RNAIA-TR
10/100 BASE-TX PHYSICAL LAYER TRANSCEIVER
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Style d'emballage :QFN-24 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2339 | ||||||||||
Microchip KSZ8081RNAIA-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8081 and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying new lead frame with more Ag area on DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:December 30, 2022 (date code: 2253)
Description of Change:Qualification of FH-SC13/HR-5104 as new die attach material and G700LTD mold compound for selected Atmel ATA5577M1330C-UFQW and ATA5577M133DC-UFQW catalog part numbers (CPN) available in 2L XDFN (1.5x2x0.37mm) package at NSEB assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying FH-SC13/HR-5104 as new die attach material and G700LTD mold compound at NSEB assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 15, 2023 (date code: 2303)
Description of Change:Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8081 and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying new lead frame with more Ag area on DAP surface prep.
Statut du produit:
Microchip KSZ8081RNAIA-TR - Caractéristiques techniques
| Supply Voltage-Nom: | 3.3V |
| No of Functions / Channels: | 2 |
| Interface Type: | RMII |
| Style d'emballage : | QFN-24 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par
Style d'emballage :
QFN-24
Méthode de montage :
Surface Mount