Référence fabricant
MCP79411-I/SN
I2C GP RTCC, 1KB EE, 64B SRAM, EUI-48
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2334 | ||||||||||
Microchip MCP79411-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip MCP79411-I/SN - Caractéristiques techniques
| Interface Type: | I2C |
| Clock Frequency-Max: | 400kHz |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP79411-I/SN is a low-power I2C Real-Time Clock/Calender with EEPROM, SRAM, Unique ID and Battery Switchover. Available in surface mount SOIC-8 package.
Features:
- Real-Time Clock/Calendar (RTCC), Battery Backed:
- Hours, Minutes, Seconds, Day of Week, Day, Month, Year and Leap Year
- Dual alarm with single output
- On-Chip Digital Trimming/Calibration:
- Range -127 to +127 ppm
- Resolution 1 ppm
- Programmable Open-Drain Output Control:
- CLKOUT with 4 selectable frequencies
- Alarm output
- 64 Bytes SRAM, Battery Backed
- 1 Kbits EEPROM (128x8):
- 8 bytes/page
- Block/sector write protection
- Protect none, 1/4, 1/2 or all of array
- Separate 64-Bit Unique ID:
- User or factory programmable
- Protected area
- EUI-48™ or EUI-64™ MAC address
- Custom ID programming
- Automatic VCC Switchover to VBAT Backup supply
- Power-Fail Time-Stamp for Battery Switchover
- Low-Power CMOS Technology:
- Dynamic Current: 400 µA max read
- Dynamic Current: 3mA max EEPROM write
- Battery Backup Current: <700nA @ 1.8V
- I2C 100 kHz and 400 kHz Compatibility
- ESD Protection >4,000V
- More than 1 Million Erase/Write Cycles
- Packages include 8-Lead SOIC, TSSOP, 2x3 TDFN, MSOP
- Pb-Free and RoHS Compliant
- Temperature Ranges:
- Industrial (I): -40°C to +85°C.
Applications:
- Lithium-Ion/Lithium-Polymer Battery Chargers
- Personal Data Assistants
- Cellular Telephones
- Digital Cameras
- MP3 Players
- Bluetooth Headsets
- USB Chargers
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount