Référence fabricant
MCP23S08T-E/SO
MCP23S08 Series 8-Bit Bidirectional I/O Expander w/ Serial Interface - SOIC-18
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1100 par Reel Style d'emballage :SOIC-18 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2312 | ||||||||||
Microchip MCP23S08T-E/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the MCP23008/MCP23S08 8-Bit I/O Expander with Serial Interface of devices.Description of Change: Revision Includes:� Updated description in Section �Features�.� Updated Table 1-1.� Corrected drawings for MCP23008 in Section Package Types.� Corrected Section 1.6.1 �I/O Direction (IODIR) Register�� Corrected packages drawings in Section 3.0 �Packaging Information�.� Updated Section �Product Identification System�, with Automotive Qualified devices.� Minor text and format changes throughout.Reason for Change: To Improve Productivity
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
Microchip MCP23S08T-E/SO - Caractéristiques techniques
| Interface Type: | SPI |
| No of Channels: | 1 |
| Clock Frequency-Max: | 10MHz |
| No of I/O Lines: | 8 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Supply Current: | 1mA |
| Style d'emballage : | SOIC-18 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1100 par Reel
Style d'emballage :
SOIC-18
Méthode de montage :
Surface Mount