Référence fabricant
MCP2140T-I/SO
MCP2140 Series 9.6 kBaud 64 Byte Standard Protocol Stack Controller - SOIC-18
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1100 par Reel Style d'emballage :SOIC-18 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP2140T-I/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC.Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
Microchip MCP2140T-I/SO - Caractéristiques techniques
| Supply Voltage-Nom: | 3V to 5.5V |
| No of Functions / Channels: | 1 |
| Interface: | Serial |
| Style d'emballage : | SOIC-18 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP2140T-I/SO is a cost-effective IrDA Standard Protocol Stack Controller with fixed 9600 baud communication rate for wireless connectivity. Available in surface mount SOIC-18 package.
This IrDA protocol provides bit encoding/decoding with lowest cost and lowest power consumption solution for adding IrDA connectivity to embedded systems
Features:
- Implements the IrDA® standard, including:
- IrLAP
- IrLMP
- IAS
- TinyTP
- IrCOMM (9-wire “cooked” service class)
- Provides IrDA standard physical signal layer support including:
- Bidirectional communication
- CRC implementation
- Fixed Data communication rate of 9600 baud
- Includes UART-to-IrDA standard encoder/decoder functionality:
- Easily interfaces with industry standad UARTs and infrared transceivers
- UART interface for connecting to Data Communications Equipment (DCE) or Data Terminal Equipment (DTE) systems
- Transmit/Receive formats (bit width) supported: 1.63μs
- Hardware UART Support:
- 9.6 kbaud baud rate
- 29 Byte Data Buffer Size
- Infrared Supported:
- 9.6 kbaud baud rate
- 64 Byte Data Packet Size
- Operates as Secondary Device
- Automatic Low Power mode- < 60 μA when no IR activity present (PHACT = L)
Applications:
- Infrared Communications Controller
Emballages disponibles
Qté d'emballage(s) :
1100 par Reel
Style d'emballage :
SOIC-18
Méthode de montage :
Surface Mount