Référence fabricant
MCP2515T-I/SO
MCP2515 Series 5.5 V 1 Mb/s Stand Alone SPI Interface CAN Controller- SOIC-18
Microchip MCP2515T-I/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
Microchip MCP2515T-I/SO - Caractéristiques techniques
Interface: | SPI |
Data Rate-Max: | 1MBd |
Supply Voltage-Nom: | 2.7V to 5.5V |
Style d'emballage : | SOIC-18 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP2515 series of stand-alone Controller Area Network (CAN) controller that implements the CAN specification, version 2.0B. It is capable of transmitting and receiving both standard and extended data and remote frames.
The MCP2515 has two acceptance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCUs overhead. The MCP2515 interfaces with microcontrollers (MCUs) via an industry standard Serial Peripheral Interface (SPI). It is pin and function compatible with the MCP2510 and also includes upgraded features like faster throughput, databyte filtering, and support for time-triggered protocols.
Features:
- 18-pin package
- Simple SPI interface to any MCU
- One-shot mode ensures message transmission is attempted only once
- Databyte filtering
- Start-of-Frame (SOF) output
- Low-power CMOS Technology
View the complete product family of MCP2515 series CAN
Emballages disponibles
Qté d'emballage(s) :
1100 par Reel
Style d'emballage :
SOIC-18
Méthode de montage :
Surface Mount