Référence fabricant
MCP9808T-E/MC
MCP9808 Series 3.6 V Memory Module Digital Temperature Sensor SMT - DFN-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :DFN-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2427 | ||||||||||
Microchip MCP9808T-E/MC - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
CCB 1474 Initial Notice: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Description of Change: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Pre Change: EFTEC-64T lead-framePost Change: EFTEC-64T or C194 lead-frameReason for Change: To improve on-time delivery performance by qualifying an additional lead frame materialNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip MCP9808T-E/MC - Caractéristiques techniques
| Output Type: | Digital |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Operating Temp Range (°F): | -40°F to +257°F |
| Style d'emballage : | DFN-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP9808 digital temperature sensor converts temperatures between −20 °C and +100 °C to a digital word with ±0.5 °C (max.) accuracy. The MCP9808 comes with user-programmable registers that provide flexibility for temperature sensing applications. The registers allow user-selectable settings such as Shutdown or low-power modes and the specification of temperature Event and Critical output boundaries.
Features:
- Accuracy:
- ±0.25 (typical) from -40°C to +125°C
- ±0.5°C (maximum) from -20°C to 100°C
- ±1°C (maximum) from -40°C to +125°C
- User-Selectable Measurement Resolution:
- +0.5°C, +0.25°C, +0.125°C, +0.0625°C
- User-Programmable Temperature Limits:
- Temperature Window Limit
- Critical Temperature Limit
- User-Programmable Temperature Alert Output
- Operating Voltage Range: 2.7 V to 5.5 V
- Operating Current: 200 μA (typical)
- Shutdown Current: 0.1 μA (typical)
- 2-wire Interface: I2C™/SMBus Compatible
Applications:
- Thermostat
- General Purpose
- Industrial Applications
- Handheld/Portable Devices
- Food Processing Equipment
- Industrial Freezers and Refrigerators
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
DFN-8
Méthode de montage :
Surface Mount