NXP | LM75BDP,118

The LM75BDP,118 is a temperature-to-digital converter using an on-chip band gap temperature sensor and Sigma-Delta A-to-D conversion technique with an overtemperature detection output.

The LM75B contains a number of data registers: Configuration register (Conf) to store the device settings such as device operation mode, OS operation mode, OS polarity and OS fault queue as described; temperature register (Temp) to store the digital temp reading, and set-point registers (Tos and Thyst) to store programmable overtemperature shutdown and hysteresis limits, that can be communicated by a controller via the 2-wire serial I2C-bus interface.

The device also includes an open-drain output (OS) which becomes active when the temperature exceeds the programmed limits. There are three selectable logic address pins so that eight devices can be connected on the same bus without address conflict.

Features:

• Pin-for-pin replacement for industry standard LM75 and LM75A and offers improved temperature resolution of 0.125 °C and specification of a single part over power supply range from 2.8 V to 5.5 V
• I2C-bus interface with up to 8 devices on the same bus
• Power supply range from 2.8 V to 5.5 V
• Temperatures range from -55 °C to +125 °C
• Frequency range 20 Hz to 400 kHz with bus fault time-out to prevent hanging up the bus
• 11-bit ADC that offers a temperature resolution of 0.125 °C
• Temperature accuracy of:
• ±2 °C from -25 °C to +100 °C
• ±3 °C from -55 °C to +125 °C
• Programmable temperature threshold and hysteresis set points
• Supply current of 1.0 mA in shutdown mode for power conservation
• Stand-alone operation as thermostat at power-up
• ESD protection exceeds 4500 V HBM per JESD22-A114, 450 V MM per JESD22-A115 and 2000 V CDM per JESD22-C101
• Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
• Small 8-pin package types: SO8, TSSOP8 and 3 mm ´ 2 mm XSON8U

Applications:

• System thermal management
• Personal computers
• Electronics equipment
• Industrial controllers