Référence fabricant
MCP1630-E/MC
Microchip Technology Switching Controllers Hi Spd PWM
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Bulk Style d'emballage :DFN-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2043 | ||||||||||
Microchip MCP1630-E/MC - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the MCP1630/V Data Sheet of devicesNotification Status: FinalDescription of Change:1. Minor layout changes.2. Added automotive qualification to Features, Description and Product Identification System.3. Updated Section 6.0 �Packaging Information�.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 25 Jul 2022
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Statut du produit:
Microchip MCP1630-E/MC - Caractéristiques techniques
| Supply Current-Max: | 2.8mA |
| Supply Voltage: | 3V to 5.5V |
| Input Voltage: | 3V to 5.5V |
| Topology: | Buck/Boost/Flyback |
| Duty Cycle-Max: | 0.99% |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +125°C |
| Thermal Resistance: | 50.8°C/W |
| Style d'emballage : | DFN-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1 par Bulk
Style d'emballage :
DFN-8
Méthode de montage :
Surface Mount