Référence fabricant
MCP4726A0T-E/CH
Single, 12-bit NV DAC with Ext Vref and I2C interface
Microchip MCP4726A0T-E/CH - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status:In ProgressEstimated First Ship Date:February 16, 2023 (date code: 2307)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
Microchip MCP4726A0T-E/CH - Caractéristiques techniques
Interface: | I2C |
No of Channels: | 1 |
Resolution: | 12b |
Supply Voltage: | 2.7V to 5.5V |
Settling Time: | 6s |
On-Chip DAC: | 1-chx12-bit |
Operating Temp Range: | -40°C to +125°C |
Storage Temperature Range: | -65°C to +150°C |
Style d'emballage : | SOT-23-6 (SOT-26) |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-6 (SOT-26)
Méthode de montage :
Surface Mount