Référence fabricant
MCP4725A0T-E/CH
MCP4725 Series 1 Ch I2C EEPROM Memory 5.5 V 12-Bit D/A Converter SMT - SOT-23-6
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Style d'emballage :SOT-23-6 (SOT-26) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2333 | ||||||||||
Microchip MCP4725A0T-E/CH - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status:In ProgressEstimated First Ship Date:February 16, 2023 (date code: 2307)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Type:Document ChangeNotification Subject:Data Sheet - MCP4725 Data Sheet Document RevisionDescription of Change: The following is the list of modifications:1) Added information related to 6-Lead, 2 x 2 mm DFN package option throughout the document.2) Updated Features3) Updated General Description4) Updated Package Types5) Updated Temperature Characteristics6) Updated Section 3.0 �Pin Descriptions� and Table 3-1.7) Updated Section 10.0 �Packaging Information�.8) Updated Product Identification System.9) Various typographical and style updates throughout the document.10) Updated literature number to the current Microchip format. The new unique literature number used to identify this document is DS20002039.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 05 Feb 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Statut du produit:
Microchip MCP4725A0T-E/CH - Caractéristiques techniques
| Interface: | I2C |
| No of Channels: | 1 |
| Resolution: | 12b |
| Supply Voltage: | 2.7V to 5.5V |
| Settling Time: | 6µs |
| On-Chip DAC: | 1-chx12-bit |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +150°C |
| Moisture Sensitivity Level: | 1 |
| Style d'emballage : | SOT-23-6 (SOT-26) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP4725A0T-E/CH is a Low-power, High accuracy, Single channel, 12-Bit Digital-to-Analog Converter with EEPROM Memory. Its on-board precision output amplifier allows it to achieve rail-to-rail analog output swing.
The non-volatile memory feature enables the DAC device to hold the DAC input code during power-off time, and the DAC output is available immediately after power-up. This feature is very useful when the DAC device is used as a supporting device for other devices in the network.
Features:
- 12-Bit Resolution
- On-Board Non-Volatile Memory (EEPROM)
- External A0 Address Pin
- Normal or Power-Down Mode
- Fast Settling Time of 6 µs (typical)
- Low Power Consumption
- Single-Supply Operation: 2.7 V to 5.5 V
- I2C Interface
Applications:
- Set point or offset trimming
- Sensor calibration and closed-loop servo control
- Low power portable instrumentation
- PC Peripherals and data acquisition systems
Emballages disponibles
Qté d'emballage(s) :
3000 par
Style d'emballage :
SOT-23-6 (SOT-26)
Méthode de montage :
Surface Mount