Référence fabricant
MCP6542-I/SN
MCP6542 Series 5.5 V 1 pA Push-Pull Output Sub-Microamp Comparator - SOIC-8
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP6542-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the MCP6541/1R/1U/2/3/4 Push-Pull Output Sub-Microamp Comparators Data Sheet of devices.Notification Status: FinalDescription of Change: Revision includes:1. Updated Section 5.1, Package Marking Information.2. Made minor formatting changes throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 Oct 2022
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip MCP6542-I/SN - Caractéristiques techniques
| Type: | General Purpose |
| No of Channels: | 2 |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.6V to 5.5V |
| Thermal Resistance: | 163°C/W |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Features:
- Low Quiescent Current: 600 nA/comparator (typ.)
- Rail-to-Rail Input: VSS - 0.3 V to VDD + 0.3 V
- CMOS/TTL-Compatible Output
- Propagation Delay: 4 μs (typ., 100 mV Overdrive)
- Wide Supply Voltage Range: 1.6 V to 5.5 V
- Available in Single, Dual and Quad
- Chip Select (CS) with MCP6543
- Low Switching Current
- Internal Hysteresis: 3.3 mV (typ.)
- Temperature Ranges:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Applications:
- Laptop Computers
- Mobile Phones
- Metering Systems
- Hand-held Electronics
- RC Timers
- Alarm and Monitoring Circuits
- Windowed Comparators
- Multi-vibrators
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount