Référence fabricant
MCP625-E/MF
MCP625 Series 5.5 V 20 MHz 2 Channel mCal Operational Amplifier - DFN-8LD
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :50 par Tube Style d'emballage :DFN-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP625-E/MF - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Statut du produit:
Microchip MCP625-E/MF - Caractéristiques techniques
| Amplifier Type: | General Purpose |
| No of Channels: | 2 |
| Slew Rate-Nom: | 10V/µs |
| Input Offset Voltage-Max: | 200µV |
| Gain Bandwidth Product: | 20MHz |
| Average Bias Current-Max: | 5pA |
| Supply Voltage: | 2.5V to 5.5V |
| Common Mode Rejection Ratio: | 84dB |
| Supply Current: | 2.5mA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 76dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 126dB |
| Phase Margin: | 60° |
| Low Noise: | 13nV/√Hz |
| Output Current: | 130mA |
| Style d'emballage : | DFN-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP625 family of operational amplifiers feature low offset. At power-up, these op amps are self-calibrated using mCal.
Some package options also provide a calibration/chip select pin that supports a low power mode of operation, with offset calibration at the time normal operation is re-started. These amplifiers are optimized for high speed, low noise and distortion, single-supply operation with rail-to-rail output and an input that includes the negative rail.
Features:
- Gain Bandwidth Product: 20 MHz (typical)
- Short Circuit Current: 70 mA (typical)
- Noise: 13 nV/√Hz (typical, at 1 MHz)
- Calibrated Input Offset: ±200 μV (maximum)
- Rail-to-Rail Output
- Slew Rate: 10 V/μs (typical)
- Supply Current: 2.5 mA (typical)
- Power Supply: 2.5 V to 5.5 V
- Extended Temperature Range: -40°C to +125°C
Applications:
- Driving A/D Converters
- Power Amplifier Control Loops
- Barcode Scanners
- Optical Detector Amplifier
View the complete product family of MCP62x series Operational Amplifier
Emballages disponibles
Qté d'emballage(s) :
50 par Tube
Style d'emballage :
DFN-8
Méthode de montage :
Surface Mount
