Référence fabricant
MCP616-I/SN
MCP616 Series 2.3 V to 5.5 V 0.08 V/µs Micropower Bi-CMOS Op Amps - SOIC-8
Microchip MCP616-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip MCP616-I/SN - Caractéristiques techniques
Amplifier Type: | CMOS |
No of Channels: | 1 |
Slew Rate-Nom: | 0.08V/µs |
Input Offset Voltage-Max: | 150µV |
Gain Bandwidth Product: | 190kHz |
Average Bias Current-Max: | 15nA |
Supply Voltage: | 2.3V to 5.5V |
Common Mode Rejection Ratio: | 100dB |
Output Type: | Rail to Rail |
Operating Temp Range: | -40°C to +85°C |
DC Voltage Gain: | 120dB |
Phase Margin: | 57° |
Style d'emballage : | SOIC-8 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount