Référence fabricant
MCP607-I/SN
MCP607 Series 6 V 155 kHz Micropower CMOS Operational Amplifier - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2201 | ||||||||||
Microchip MCP607-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip MCP607-I/SN - Caractéristiques techniques
| Amplifier Type: | General Purpose |
| No of Channels: | 2 |
| Slew Rate-Nom: | 0.08V/µs |
| Input Offset Voltage-Max: | 250µV |
| Gain Bandwidth Product: | 155kHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 2.5V to 6V |
| Common Mode Rejection Ratio: | 91dB |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 93dB |
| Operating Temp Range: | -40°C to +85°C |
| DC Voltage Gain: | 121dB |
| Phase Margin: | 62° |
| Low Noise: | 38nV/√Hz |
| Output Current: | 17mA |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP607 dual operational amplifier (op amp) has a gain bandwidth product of 155 kHz with a low typical operating current of 18.7 and an offset voltage that is less than 250 µV.
The MCP607 uses Microchip's advanced CMOS technology, which provides low bias current, high-speed operation, high open-loop gain and rail-to-rail output swing. The MCP607 operates with a single supply voltage that can be as low as 2.5 V, while drawing less than 25 of quiescent current per amplifier. The MCP607 is available in standard 8-lead PDIP, SOIC and TSSOP packages.
Features:
- Low Input Offset Voltage: 250 µV (max.)
- Rail-to-Rail Output
- Low Input Bias Current: 80 pA (max. at 85°C)
- Low Quiescent Current: 25 µA (max.)
- Power Supply Voltage: 2.5 V to 5.5 V
- Unity-Gain Stable
- Chip Select (CS) Capability: MCP608
- Industrial Temperature Range: -40°C to +85°C
- No Phase Reversal
- Available in Single, Dual and Quad Packages
Applications:
- Battery Power Instruments
- High-Impedance Applications
- Photodiode Amplifier
- pH Probe Buffer Amplifier
- Infrared Detectors
- Precision Integrators
- Charge Amplifier for Piezoelectric Transducers
- Strain Gauges
- Medical Instruments
- Test Equipment
View the complete MCP607 family of Operational Amplifiers
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount
