Référence fabricant
MCP602-I/ST
dual op am 2.7 v, I temp
Microchip MCP602-I/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the 2.7V to 6.0V Single Supply CMOS Op Amps of devices.Description of Change:Updated Section �Features�.Updated Section 2.0 �Typical Performance Curves�.Updated Section 6.0 �Packaging Information�.Updated Section �Product Identification System�.Added Section �Product Identification System (Automotive)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected various device families available in 8L TSSOP (4.4mm) package at MMT assembly site.Reason for Change:To improve manufacturability and qualify palladium coated copper with gold flash (CuPdAu) bond wire. Estimated First Ship Date:March 17, 2022 (date code: 2212)
Statut du produit:
Microchip MCP602-I/ST - Caractéristiques techniques
Amplifier Type: | CMOS |
No of Channels: | 2 |
Slew Rate-Nom: | 2.3V/µs |
Input Offset Voltage-Max: | 2mV |
Gain Bandwidth Product: | 2.8MHz |
Supply Voltage: | 2.7V to 6V |
Common Mode Rejection Ratio: | 90dB |
Supply Current: | 23µA |
Output Type: | Rail to Rail |
Power Supply Rejection Ratio: | 88dB |
Operating Temp Range: | -40°C to +85°C |
DC Voltage Gain: | 115dB |
Phase Margin: | 50° |
Moisture Sensitivity Level: | 1 |
Style d'emballage : | TSSOP-8 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount