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Référence fabricant
2102847-1
Black 112 Position 16 Columns 20.3 mm Pitch Right Angle Daughtercard Connector
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| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :17 par Tube | ||||||||||
| Code de date: | 2309 | ||||||||||
TE Connectivity 2102847-1 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process.Reason for Changes:Product improvement. Reduce FOD (Foreign Object Debris) during assembly process.
Subject: NOE-23-053 – Multigig Daughtercard Connectors – Update Update Summary:• Our supplier has provided an 8D report to TE Connectivity (TE) and we have completed our internal 8D report. This report is available upon request.• As previously communicated, our Risk Assessment testing is complete. Results showed that product performed per the TE Product Specification. We have internally dispositioned product Use-As-Is.• Because tested product performed per the Product Specification, we continue to recommend a use-as-is disposition to our customers.• We expect to issue a formal closure letter regarding this NOE no later than February 28, 2025.
***ALERT UPDATE OF FPCN106234 - WITH ADDITIONAL PART NUMBERS & DATE CODES ***Update Summary:• TE has expanded the scope of this Notice of Escape to date code range 2107 through 2408• The root cause, failure mode, and corrective action remain the same• TE will provide a testing progress update on or before October 28, 2024Dear Valued Customer,This letter is an update to Notice of Escape (NOE) 23-053 on Multigig Daughtercard connectors. While the failure mode and corrective action have not changed, TE Connectivity (TE) has revised the date code range of affected connectors. Your organization may be receiving this notice for the first time because of this expanded investigation.ScopeThe original NOE described the issue of gold flaking in specific batches within a date code range of 2131 through 2340 (2021, week 31 through 2023, week 40). The updated date code range is 2107 through 2408 (2021, week 7 through 2024, week 8). Due to supplier data corruption, TE cannot evaluate product prior to date code 2106. We are conducting risk assessment testing on the specific part numbers and date codes identified in the attached file. We expect to complete this testing by December 20, 2024.Description of Non-Compliance Through customer notification, we identified that gold plating on the PCBs internal to the affected Daughtercard connectors may flake when adhesion testing (tape testing per IPC 6012E) is performed. This means that conductive gold debris could be dislodged from the pad surface during mating, which may lead to a short circuit within the connector or another electrical connection within the applied system. In addition, the less conductive nickel underplate may result in a higher resistance on the signal path, leading to increased insertion loss. In testing completed to date, these potential concerns have not been realized, and we have no record f functional issues or potential concerns related to this non-conformance in fielded product. TE continues to partner with customers to identify any further concerns related to this issue.Containment and Corrective actionIn a previous update, we noted that our supplier had completed their investigation and determined that their process had been applying the incorrect amount of electrical current on an intermittent basis
Description of ChangesReducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process.Reason for Changes:Product improvement.
General Product Description:MULTIGIG RT2 and RT2-R Daughter connectorsDescription of ChangesIncrease the width of the wafer slots on the housing(Shroud) by 0.09mm in order to reduce the risk of FOD (Foreign Object Debris) that can be generated by insertion of the PWB wafers during parts assemblyReason for Changes:Product improvement.Manufacturing requested.First Date To Ship (Changed Parts Only):31-MAR-2023Last Date for Mixed Shipments: (Changed Parts Only):30-APR-2023
Description of ChangesPress Fit contacts used on the listed Multigig connectors are currently stamped and plated at Outside Vendors. An additional Outside vendor has been qualified for the Plating process. There are no changes to the specifications for the part or other plating changes. This change is specifically focused on having a new plating source for an existing design.Reason for Changes:Dear Customer, we hereby inform you about a transfer of Plating process to another TE approved Outside Vendor. The transfer follows a strict procedure, which fully maintains quality, ability to supply and form-fit-function of the concerned products. The new Plating Vendor already plates Multigig contacts according to similar requirements and that are geometrically similar with great success. The benefit is that this prior experience will allow this Vendor to provide quality product to TE allowing us to more consistently meet customer demand in the Multigig product line.
Statut du produit:
TE Connectivity 2102847-1 - Caractéristiques techniques
| No of Positions: | 112 |
Emballages disponibles
Qté d'emballage(s) :
17 par Tube