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Manufacturer Part #
PIC16F15224T-I/SL
PIC series MCU IC 8-Bit 32MHz 7KB (4K x 14) FLASH 14-SOIC
Microchip PIC16F15224T-I/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of CuPdAu as an additional bond wire material for selected ATTINY16xx, ATTINY4xx, ATTINY2xx, ATTINY8xx, ATTINY3224 and PIC16F1xxxx device families available in 14L SOIC (.150in) package assembled at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Microchip has released a new Errata for the PIC16F15213/14/23/24/43/44 Silicon Errata and Data Sheet Clarifications of devices.Description of Change: Added silicon revision A8.Reason for Change: To Improve ProductivityDate Document Changes Effective: 28 Sep 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Errata for the PIC16F15213/14/23/24/43/44 Silicon Errata and Data Sheet Clarifications of devices.Description of Change: Added silicon errata item 1.7.1.Reason for Change: To Improve Productivity Date Document Changes Effective: 05 Sep 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Errata for the PIC16F15213/14/23/24/43/44 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: Added silicon revision A7.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 25 Jun 2022
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Available Packaging
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2600 per Reel