Manufacturer Part #
SST39VF020-70-4C-WHE
SST39VF Series 2 Mbit 256K x 8 3 V Multi-Purpose Flash - TSOP-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:208 per Tray Package Style:TSOP-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2226 | ||||||||||
Microchip SST39VF020-70-4C-WHE - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 11, 2022: Issued initial notification.April 20, 2022: Re-issued initial notification. Updated Qualification Plan. Added BQM, Pin 1 Orientation, tray and reel color and packing method in the Pre and Post Change summary.July 12, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 13, 2022.Description of Change:Qualification of MTAI as a new final test location for selected SST39LF0xx, SST39LF2xx and SST39VF0xx device families available in various packages.Reason for Change:To improve manufacturability by qualifying MTAI as a new final test location.
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as a new final test location for selected SST39LF0xx, SST39LF2xx and SST39VF0xx device families available in various packages.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as a new final test location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2022
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as a new final test location for selected SST39LF0xx, SST39LF2xx and SST39VF0xx device families available in various packages.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as a new final test location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:March 2022
Part Status:
Microchip SST39VF020-70-4C-WHE - Technical Attributes
| Memory Density: | 2Mb |
| Memory Organization: | 256 K x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 70ns |
| Package Style: | TSOP-32 |
| Mounting Method: | Surface Mount |
Features & Applications
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SST39VF020-70-4C-WHE is a part of SST39VF Series Multi-Purpose Flash Plus. It has an standard operating temperature ranging from -40°C to +85°C, it comes in TSOP-32 package.
The SST39VF020 is a 256K x8CMOS Multi-Purpose Flash (MPF) manufactured with SST proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.
Features:
- Organized as 64K x8 / 128 K x8 / 256 K x8 / 512 K x8
- Single 2.7-3.6 V Read and Write Operations
- Superior Reliability
- Endurance: 100,000 Cycles (typical)
- Greater than 100 years Data Retention
- Low Power Consumption (typical values at 14 MHz)
- Active Current: 5 mA (typical)
- Standby Current: 1 μA (typical)
- Sector-Erase Capability
- Uniform 4 KByte sectors
- Fast Read Access Time: 45 ns ; 55 ns ; 70 ns
- Latched Address and Data
- Automatic Write Timing
- Internal VPP Generation
- Fast Erase and Byte-Program
- Sector-Erase Time: 18 ms (typical)
- Chip-Erase Time: 70 ms (typical)
- Byte-Program Time: 14 μs (typical)
- End-of-Write Detection
- Toggle Bit
- Data# Polling
- CMOS I/O Compatibility
- JEDEC Standard
- Flash EEPROM Pinouts and command sets
Available Packaging
Package Qty:
208 per Tray
Package Style:
TSOP-32
Mounting Method:
Surface Mount