Référence fabricant
MC74LCX541DTR2G
74LCX Series 2.3 to 3.6 V 24 mA CMOS Octal Buffer - TSSOP-20
onsemi MC74LCX541DTR2G - Spécifications du produit
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onsemi MC74LCX541DTR2G - Caractéristiques techniques
Logic Circuit: | Buffer |
Family: | VCX/LCX |
No of Functions / Channels: | 8 |
Output Characteristics: | 3-ST |
Supply Voltage-Nom: | 2V to 3.6V |
Supply Current: | ±100mA |
Propagation Delay: | 7.5ns |
Operating Temperature: | -40°C to +85°C |
Capacitance: | 25pF |
No of Inputs: | 8 |
No of Outputs: | Triple |
High Level Output Current: | -24mA |
Low Level Output Current: | 24mA |
No of Pins: | 20 |
Quiescent Current: | 10µA |
Moisture Sensitivity Level: | 1 |
Style d'emballage : | TSSOP-20 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MC74LCX541 is a high performance, non-inverting octal buffer operating from a 2.3 to 3.6V supply. This device is similar in function to the MC74LCX244, while providing flow through architecture.
High impedance TTL compatible inputs significantly reduce current loading toinput drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5V allows MC74LCX541 inputs to besafely driven from 5V devices. The MC74LCX541 is suitable for memory address driving and all TTL level bus oriented transceiver applications. Current drive capability is 24mA at the outputs. The Output Enable(OE1bar, OE2bar) inputs, when HIGH, disables the output by placing them in a HIGH Z condition.
Key Features:
- Designed for 2.3 to 3.6 V VCC Operation
- 5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
- LVTTL Compatible
- LVCMOS Compatible
- 24 mA Balanced Output Sink and Source Capability
- Near Zero Static Supply Current (10 µA) Substantially Reduces System Power Requirements
- Latchup Performance Exceeds 500 mA
- ESD Performance
- Human Body Model >2000 V
- Machine Model >200 V
- Pb−Free Packages are Available
Learn more about the MC74LCX541 family of 74 Series
Emballages disponibles
Qté d'emballage(s) :
2500 par Reel
Style d'emballage :
TSSOP-20
Méthode de montage :
Surface Mount