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Manufacturer Part #
FF4MR12W2M1HB11BPSA1
1200 V 170 A Dual N-Channel Chassis Mount CoolSiC Trench MOSFET Module
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:15 per Tray Package Style:Module Mounting Method:Chassis Mount | ||||||||||
| Date Code: | 2332 | ||||||||||
Product Specification Section
Infineon FF4MR12W2M1HB11BPSA1 - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
File
Date
Wafer Size Change
04/02/2025 Details and Download
Location Change
01/29/2025 Details and Download
Description:Introduction of an additional wafer production location at Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia for products with CoolSiC™ MOSFET 1200V Gen. 1.Reason for change:Introduction of an additional wafer production location at Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia for products with CoolSiC™ MOSFET 1200V Gen. 1.
Part Status:
Active
Active
Infineon FF4MR12W2M1HB11BPSA1 - Technical Attributes
Attributes Table
| Technology: | SiCFET (Silicon Carbide) |
| Gate-Source Voltage-Max [Vgss]: | 23V |
| Isolation Voltage-RMS: | 3000V |
| Drain-to-Source Voltage [Vdss]: | 1200V |
| Drain Current: | 170A |
| Configuration: | Half Bridge |
| Operating Temp Range: | -40°C to +175°C |
| Package Style: | Module |
| Mounting Method: | Chassis Mount |
Pricing Section
Global Stock:
2
USA:
2
On Order:
0
Factory Lead Time:
12 Weeks
Quantity
Unit Price
15+
$193.01
Product Variant Information section
Available Packaging
Package Qty:
15 per Tray
Package Style:
Module
Mounting Method:
Chassis Mount
