Manufacturer Part #
WP34C2R6NFEI450B2R
WP3 4C2R6 450 MHZ, LF BALLS, PBF
Microchip WP34C2R6NFEI450B2R - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:May 05, 2021: Issued initial notification.August 10, 2021: Issued final notification. Provided estimated first ship date will be on September 15, 2021.August 24, 2021: Re-issued final notification to add CCB 4644.001 as internal reference. Added catalog part numbers (CPN) WP32C2M6NHEI-400B2, WP32C0W5NHEI-450B2 and WP3232M5NHEI-320B2 in affected CPN list.March 17, 2022: Re-issued final notification to update Pre and Post Change Summary Table.Description of Change:Qualification of an additional substrate material for selected Microsemi WP3232Mxxx, WP32C2xxx, WP32C0xxx, WP3362xxx, WP3392xxx, WP33C2xxx and WP34C2xxx device families available in 896L B1BGA (31x31x2.70mm) and 896L B2BGA (31x31x3.25mm) packages at ASE assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet: None.Change Impact:None.Reason for Change:To improve productivity by qualifying an additional substrate material.Change Implementation Status:In ProgressEstimated First Ship Date:September 15, 2021 (date code: 2138)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change:Qualification of an additional substrate material for selected Microsemi WP3232Mxxx, WP32C2xxx, WP32C0xxx, WP3362xxx, WP3392xxx, WP33C2xxx, WP34C2xxx, T2C0xxx and T2C2xxx device families available in 896L B1BGA (31x31x2.70mm) and 896L B2BGA (31x31x3.25mm) packages at ASE assembly site.Impacts to Data Sheet: None.Change Impact:None.Reason for Change:To improve productivity by qualifying an additional substrate material.Change Implementation Status:In ProgressEstimated First Ship Date:September 15, 2021 (date code: 2138)
Part Status:
Available Packaging
Package Qty:
1 per Bulk