Manufacturer Part #
MCP6072T-E/SN
MCP6072 Series 6 V 1.2 MHz Dual Operational Amplifier - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2329 | ||||||||||
Microchip MCP6072T-E/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Microchip has released a new Product Documents for the MCP6071 Family Data Sheet of devices.Notification Status: FinalDescription of Change:Added Markings table for TDF package option, in Section 6.1 �Package Marking Information�Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 07 Nov 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Microchip MCP6072T-E/SN - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 2 |
| Slew Rate-Nom: | 0.5V/µs |
| Input Offset Voltage-Max: | 150µV |
| Gain Bandwidth Product: | 1.2MHz |
| Average Bias Current-Max: | 100pA |
| Supply Voltage: | 1.8V to 6V |
| Common Mode Rejection Ratio: | 91dB |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 87dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 115dB |
| Phase Margin: | 57° |
| Low Noise: | 19nV/√Hz |
| Output Current: | 28mA |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount