
Manufacturer Part #
AT86RF215-ZU
Dual Band IEEE 802.15.4 Transceiver
Microchip AT86RF215-ZU - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAM3S2A, ATSAM3S4A, ATSAM3S1A, ATSAM3N00A,ATSAM3N1A, ATSAM3N0A, AT91SAM7S32, AT86RF215M, ATmega1284RFR2, ATmega2564RFR2, ATmega644RFR2, AT86RF215, AT86RF215IQ, ATSAM4LS8A, ATSAM4LC8A, AT91SAM7S321, and ATSAM3N0AA device families available in 48L VQFN (7x7x1.0mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as an additional assembly site for selected AT86RF215, ATmega644/1284/2564RFR2 and ATSAM4Lx8xx device families available in 48L VQFN (7x7x0.9mm) package.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:December 29, 2021 (date code: 2153)Method to Identify Change:Traceability code
Description of Change:Qualification of MTAI as an additional assembly site for selected AT86RF215, ATmega644/1284/2564RFR2 and ATSAM4Lx8xx device families available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date:July 2021
Part Status:
Microchip AT86RF215-ZU - Technical Attributes
Data Rate: | 2.4Mbps |
Output Power: | 16dBm |
Supply Voltage: | 1.8V to 3.6V |
Sensitivity: | -123dBm |
Package Style: | QFN-48 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
416 per Tray
Package Style:
QFN-48
Mounting Method:
Surface Mount