Manufacturer Part #
24LC64T-I/SN
24LC64 Series 64 Kb I2C 2 Wire (8K X 8) 2.5 V Serial EEPROM SMT - SOIC-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2319 | ||||||||||
Microchip 24LC64T-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:April 9, 2022: Re-issued this PCN to update the affected CPN list by removing 24FC64F, 24LC64F, 24AA64F products.Notification Status: FinalDescription of Change:1) Added Product Identification System section for Automotive;2) Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings;3) Added DFN-S product offering;4) Replaced terminology Master and Slave with Host and Client, respectively;5) Replaced Automotive (E): designation with Extended (E): designation;6) Reformatted some sections for better readability.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 18 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Microchip has released a new Product Documents for the 24AA64/24FC64/24LC64 64-Kbit I2C Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 24AA64/24FC64/24LC64 64-Kbit I2C Serial EEPROM Data Sheet.Notification Status: FinalDescription of Change:1) Added Product Identification System section for Automotive;2) Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings;3) Added DFN-S product offering;4) Replaced terminology �Master� and �Slave� with �Host� and �Client�, respectively;5) Replaced �Automotive (E):� designation with �Extended (E):� designation;6) Reformatted some sections for better readability.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 18 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip 24LC64T-I/SN - Technical Attributes
| Memory Density: | 64kb |
| Memory Organization: | 8 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The 24LC64T-I/SN is a Part of 24LC64 Series with 2.5 V to 5.5 V 64 Kb I2C 2 Wire Serial EEPROM available in surface mount SOIc-8 Package. The 64kbit is organized as a single block of 8K X 8-bit memory.
It has been developed for advanced, low-power applications such as personal communications or data acquisition.
Features:
- Single Supply with Operation down to 1.7 V for 24AA64/24FC64 Devices and 2.5 V for 24LC64 devices
- Low-Power CMOS Technology:
- Active current 3 mA, typical
- Standby current 1 uA, typical
- 2-Wire Serial Interface, I2C™ CompatiblePackages with 3 Address Pins are cascadable up to 8 Devices
- Schmitt Trigger Inputs for Noise Suppression
- Output Slope Control to Elaiminate Ground Bounce
- 100 kHz and 400 kHz Clock Compatibility
- 1 MHz Clock for FC versions
- Page Write Time 5 ms, max.
- Self-timed Erase/Write Cycle
- 32-Byte Page Write Buffer
- Hardware Write-Protect
- ESD Protection > 4,000V
- More than 1 Million Erase/Write Cycles
- Data Retention > 200 Years
- Factory Programming Available
- Packages include 8-lead PDIP, SOIC, SOIJ,TSSOP, X-Rotated TSSOP, MSOP, DFN, TDFN,
- 5-lead SOT-23 or Chip Scale
- Pb-Free and RoHS Compliant
- Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount
