Manufacturer Part #
24LC256T-I/SN
24LC256 Series 256 Kb I2C 2 Wire (32K X 8) 2.5 V Serial EEPROM SMT - SOIC-8
Microchip 24LC256T-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of UMC Fab 8D as an additional fabrication site for selected 24FC256, 24AA256 and 24LC256 device families available in 8L DFN-S (6x5x0.9mm), MSOP (3x3mm), PDIP (.300in), SOIC (3.90mm), SOIJ (.208in), TDFN (2x3x0.8mm), TSSOP (4.4mm) packages.Reason for Change:To improve manufacturability by qualifying UMC Fab 8D as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:September 19, 2022 (date code: 2239)
Microchip has released a new Datasheet for the 24AA256/24LC256/24FC256 256K I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: Added 5-Lead SOT-23 package. Updated MSOP, PDIP, SOIC and SOIJ package drawings.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 28 Jul 2022
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Microchip has released a new Product Documents for the 24AA256/24LC256/24FC256 256 Kbit I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change:1) Replaced terminology �Master� and �Slave� with �Host� and �Client� respectively;2) Added Automotive Product Identification System;3) Updated DFN, PDIP, SOIC, TDFN and TSSOP package drawings.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 25 Oct 2021
Part Status:
Microchip 24LC256T-I/SN - Technical Attributes
Memory Density: | 256kb |
Memory Organization: | 32 K x 8 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 400kHz |
Write Cycle Time-Max (tWC): | 5ms |
Package Style: | SOIC-8 |
Mounting Method: | Surface Mount |
Features & Applications
This device also has a page write capability of up to 64 bytes of data. This device is capable of both random and sequential reads up to the 256 K boundary. Functional address lines allow up to eight devices on the same bus, for up to 2 Mbit address space. This device is available in the standard 8-pin plastic DIP, SOIC, TSSOP, MSOP and DFN packages.
Features:
- Single Supply with Operation Down to 2.5 V for 24LC256 Devices
- Low-Power CMOS Technology: - Active current 400 uA, typical - Standby current 100 nA, typical
- 2-Wire Serial Interface, I2C™ Compatible
- Cascadable up to Eight Devices
- Schmitt Trigger Inputs for Noise Suppression
- Output Slope Control to Eliminate Ground Bounce
- 100 kHz and 400 kHz Clock Compatibility
- Page Write Time 5 ms max.
- Self-Timed Erase/Write Cycle
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount