Manufacturer Part #
24AA64T-I/MC
24AA64 Series 64 Kbit (8K X 8) 5.5 V Surface Mount I2C Serial EEPROM - DFN-8
Microchip 24AA64T-I/MC - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:April 9, 2022: Re-issued this PCN to update the affected CPN list by removing 24FC64F, 24LC64F, 24AA64F products.Notification Status: FinalDescription of Change:1) Added Product Identification System section for Automotive;2) Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings;3) Added DFN-S product offering;4) Replaced terminology Master and Slave with Host and Client, respectively;5) Replaced Automotive (E): designation with Extended (E): designation;6) Reformatted some sections for better readability.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 18 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the 24AA64/24FC64/24LC64 64-Kbit I2C Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 24AA64/24FC64/24LC64 64-Kbit I2C Serial EEPROM Data Sheet.Notification Status: FinalDescription of Change:1) Added Product Identification System section for Automotive;2) Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings;3) Added DFN-S product offering;4) Replaced terminology �Master� and �Slave� with �Host� and �Client�, respectively;5) Replaced �Automotive (E):� designation with �Extended (E):� designation;6) Reformatted some sections for better readability.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 18 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
CCB 1474 Initial Notice: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Description of Change: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Pre Change: EFTEC-64T lead-framePost Change: EFTEC-64T or C194 lead-frameReason for Change: To improve on-time delivery performance by qualifying an additional lead frame materialNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip 24AA64T-I/MC - Technical Attributes
Memory Density: | 64kb |
Memory Organization: | 8 K x 8 |
Supply Voltage-Nom: | 1.7V to 5.5V |
Clock Frequency-Max: | 400kHz |
Write Cycle Time-Max (tWC): | 5ms |
Package Style: | DFN-8 |
Mounting Method: | Surface Mount |
Features & Applications
The 24AA64 is a 64 Kbit electrically Erasable PROM. The device is organized as a single block of 8 K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 V, with standby and active currents of only 1 μA and 1 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition.
The 24XX64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space. The 24XX64 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP,DFN, TDFN and MSOP packages. The 24XX64 is also available in the 5-lead SOT-23 package.
Features:
- Single-Supply with Operation down to 1.7 V
- Low-Power CMOS Technology
- 2-Wire Serial Interface, I2C™ Compatible
- Cascadable up to 8 Devices
- Schmitt Trigger Inputs for Noise Suppression
- Output Slope Control to Eliminate Ground Bounce
- 100 kHz and 400 kHz Clock Compatibility
- Page Write Time 5 ms, typical
- Self-timed Erase/Write Cycle
- 32-Byte Page Write Buffer
- Hardware Write-protect
- ESD Protection > 4,000 V
- More than 1 Million Erase/Write Cycles
- Data Retention > 200 Years
- Factory Programming Available
Available Packaging
Package Qty:
3300 per Reel
Package Style:
DFN-8
Mounting Method:
Surface Mount