Manufacturer Part #
LE9643AQCT
Telecom Interface ICs 1CH 100V miSLIC, 36QFN
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel | ||||||||||
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Microchip LE9643AQCT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:May 24, 2022: Issued initial notification.May 05, 2023: Issued final notification. Attached the Qualification Report. Updated the affected CPN list.Provided estimated first ship date to be on May 06, 2023.Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9643AQC, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at ASEM assembly site.Reason for Change:To improve productivity by qualifying a new die size
Revision History:May 24, 2022: Issued initial notification.May 05, 2023: Issued final notification. Attached the Qualification Report. Updated the affected CPN list.Provided estimated first ship date to be on May 06, 2023.Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9643AQC, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at ASEM assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Revision History:May 24, 2022: Issued initial notification.April 20, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on May 5, 2023.PCN Status:Final NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9621AQC, LE9643AQC, LE9621AQCT, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at MMT assembly site.Pre and Post Change Summary: See attached for more detailsReason for Change:To improve productivity by qualifying a new die size.Change Implementation Status:In ProgressEstimated First Ship Date:May 5, 2023 (date code: 2318)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached for more details
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9621AQC, LE9643AQC, LE9621AQCT, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying a new die size
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9621AQC, LE9643AQC, LE9621AQCT, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9621AQC, LE9643AQC, LE9621AQCT, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at MMT assembly site.Reason for Change:To improve productivity by qualifying a new die size
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9621AQC, LE9643AQC, LE9621AQCT, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at ASEM assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Microchip has released a new Product Documents for the Le9643 Datasheet of devices. If you are using one of these devices please read the document located at Le9643 Datasheet.Notification Status: FinalDescription of Change: Converted the legacy document to the Microchip format and updated the following sections:1) Package Outline2) Related CollateralImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Aug 2021
Revision History:March 4, 2021: Issued final notification.April 12, 2021: Issued final notification. Attached the Qualification Report.Description of Change:Qualification of MTAI as an additional assembly site for selected MSCC LE96xxx device family available in 36L VQFN (4x6x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site Estimated First Ship Date:March 1, 2021 (date code: 2110)
Description of Change:Qualification of MTAI as an additional assembly site for selected LE96xxx device family available in 36L VQFN (4x6x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site Estimated First Ship Date:March 1, 2021 (date code: 2110)
Part Status:
Available Packaging
Package Qty:
3000 per Reel