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Manufacturer Part #
MCP3913A1T-E/SS
MCP3913 Series 3.6 V 4.5 mA SMT Six-Channel Analog Front End - SSOP-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2100 per Reel Package Style:SSOP-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2506 | ||||||||||
Microchip MCP3913A1T-E/SS - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110275 ***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected dsPIC33EPxx, dsPIC33EVxx, MCP3913, MGC3030, PIC24EP12xx, PIC24EP25xx, PIC24FJ12xx, PIC24FJ64xx, PIC32MX11xx, PIC32MX12xx, PIC32MX13xx, PIC32MX15xx, PIC32MX17xx, PIC32MX21xx, PIC32MX22xx, PIC32MX23xx, PIC32MX25xx and PIC32MX27xx device families available in 28L SSOP (.209in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional bond wire material.Estimated First Ship Date: 02 June 2025 (date code: 2523)Revision History: January 16, 2025: Issued initial notification.May 9, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 2, 2025.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected dsPIC33EPxx, dsPIC33EVxx, MCP3913, MGC3030, PIC24EP12xx, PIC24EP25xx, PIC24FJ12xx, PIC24FJ64xx, PIC32MX11xx, PIC32MX12xx, PIC32MX13xx, PIC32MX15xx, PIC32MX17xx, PIC32MX21xx, PIC32MX22xx, PIC32MX23xx, PIC32MX25xx and PIC32MX27xx device families available in 28L SSOP (.209in) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Part Status:
Microchip MCP3913A1T-E/SS - Technical Attributes
| Package Style: | SSOP-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2100 per Reel
Package Style:
SSOP-28
Mounting Method:
Surface Mount