Manufacturer Part #
MCP6541-I/SN
MCP6541 Series 5.5 V 1 pA Push-Pull Output Sub-Microamp Comparator - SOIC-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6541-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Datasheet for the MCP6541/1R/1U/2/3/4 Push-Pull Output Sub-Microamp Comparators Data Sheet of devices.Notification Status: FinalDescription of Change: Revision includes:1. Updated Section 5.1, Package Marking Information.2. Made minor formatting changes throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 Oct 2022
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip MCP6541-I/SN - Technical Attributes
| Type: | General Purpose |
| No of Channels: | 1 |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.6V to 5.5V |
| Thermal Resistance: | 163°C/W |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6541 series of Push-pull, single comparator. This single-ended device operates from 1.6 V to 5.5 V, with typical quiescent current of 600 nA and a maximum of 1 microamp. This device is offered in the eight lead PDIP, SOIC, MSOP and five lead SOT-23 package.
Features:
- Low Quiescent Current: 600 nA/comparator (typ.)
- Rail-to-Rail Input: VSS - 0.3 V to VDD + 0.3 V
- CMOS/TTL-Compatible Output
- Propagation Delay: 4 µs (typ., 100 mV Overdrive)
- Wide Supply Voltage Range: 1.6 V to 5.5 V
- Available in Single, Dual and Quad
- Single available in SOT-23-5, SC-70-5 * packages
- Chip Select (CS) with MCP6543
- Low Switching Current
- Internal Hysteresis: 3.3 mV (typ.)
- Temperature Ranges:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Applications:
- Laptop Computers
- Mobile Phones
- Metering Systems
- Hand-held Electronics
- RC Timers
- Alarm and Monitoring Circuits
- Windowed Comparators
- Multi-vibrators
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount
